Laser etching and marking equipment for perovskite cells-Fornitore globale

Building 5, Fenglian Pipe Industry, No. 5 Huanglongshan East Road, Donghu Technology Development Zone, Wuhan City

The entire processing part can be placed in a glove box for processing according to the needs

Configure nanosecond pulse width infrared fiber according to the needs of different scenarios（1064nm）Green light（532nm）Band light source; Picosecond pulse width infrared fiber（1064nm）Green light（532nm）, UV（355nm）Band light source; Infrared fiber with femtosecond pulse width（1030nm）Green light（515nm）Band light sources are used for micro fine laser etching, marking, structural removal, slicing, surface peeling, and other applications.

Suitable for flexibilityPET/PI/PEN/Application of laser etching and marking on perovskite solar cells on glass and other substrate materials.

GlassPET、PI、PNTLaser etching of thin film materials on substrates, applied in industries such as touch screens, photovoltaic solar cells, and electrochromic glass.

Suitable for conductive silver pasteITO、FTOConductive metals such as zinc oxide, zirconium oxide, titanium oxide, nickel oxide, carbon powder, gold, silver, copper, aluminum, graphene, carbon nanotubes, oxides, perovskite cellsSpiro-OMeTAD、Perovskite、SnO2、C60、PCBMWaiting for material processing.Especially in the field of perovskite batteries, there are unique technical advantages in laser etching and marking technology for the cathode electrode, perovskite hole transport layer, barrier layer, perovskite layer, and anode electrode.

Adopting independently developed control software and directly importing itCADdataCCDCamera positioning automatic laser etching, easy to operate, convenient and fast; The design adopts real-time adjustment of the vibrating mirror, linear motor, and electric lifting worktable through software, combined with a vacuum adsorption tray device, which can effectively solve the smoothness of laser etching processing operation.

The equipment integrates advanced manufacturing technologies such as CNC technology, laser technology, software technology, etc., and has the characteristics of high flexibility, high precision, and high speed. It can perform precise and high-speed etching of various patterns and sizes on a large scale, and can ensure high production capacity. It is a reliable, stable, and high-performance cost-effective product.

Main components: laser, optical system, motion control system, electrical control system, positioning system, dust extraction system, vacuum adsorption system, marble gantry structure, sheet metal structural components, etc.

model	Nanosecond infrared ET650MIR		Nanosecond green lightET200MG		Picosecond green light/ultraviolet ET300MPS	Femtosecond infrared ET300IRFS			Laboratory etching machine ET200MIR
laser device	1064nm		532nm		532/355nm	1030nm			1064nm
wavelength/power	20/30W		5/10W		10/15/30W	20W			20W
Processing dimensions	100100/200200/300300/400300/600600/600900/700*1400mmoptional Customizable processing format								110110/140140/ 200*200mmoptional
Laser frequency	1-2000KHz		30-150KHz		1-1000KHz	25-5000KHz			1-2000KHz
galvanometer	10/14mmOptical aperture								10mmOptical aperture
focusing lenses	4040/7070/110*110mmFormat (selected according to different application scenarios)								100-200mmoptional
Beam expander	2X		8X/10X						1.5X
focusing spot	＜30μm		＜30μm		＜10μm				＜50μm
Minimum line width	＜30μm		＜30μm		＜10μm				＜50μm
	The coating material can be completely removed as needed, such asP4Edge cleaning treatment
Minimum line spacing	＜30μm		＜30μm		＜10μm				＜50μm
Precision of the whole machine	±15μm								/
Applicable types	Compatible with surface material treatment of flexible substrates and glass substrates
ZAxial motor stroke	50mm(Automatic software control)								hand movement500mm
Workbench positioning accuracy	±3μm								/
Workbench repeatability accuracy	±1μm								/
CCDCamera positioning accuracy	±3μm								/
etching rate	Maximum etching speed4000mm/s(Single line)
Equipment size/weight	120012001700mm（200200mmWithin the format make an appointment1000KgLarge size and dual light path 155014501750mm（600600mmWithin the format make an appointment1800KgTelephone contact							10507001660mm（LWH） make an appointment300Kg
Equipment power consumption	＜2500W			＜3000W				＜1500W
Device file format	standardCAD DXFfile							DXF/PLT/JPGclass
contrast	used forP1Conductive layerITO/FTOSingle layer material processing, some materials are engraved with multiple layers, especially for edge cleaning processing, which has a speed advantage	Compared to nanosecond infrared, it canP1/P2/P3/ P4Etching and marking can be applied toITO/FTOPerovskite functional layer, metal/Etching and marking of carbon electrode layer		Compared to nanosecond infrared, it canP1/P2/P3/ P4Etching and marking can be applied toITO/FTOPerovskite functional layer, metal/Etch and mark the carbon electrode layer. The advantage is that etching the next layer causes less damage to the previous layer, has less impact on the etching edge, and has a smaller volcanic crater			Similar to picosecond pulse width band, choose according to different scenarios	Only suitable for etching single-layer materials, can be customized with miniaturized product sizes according to needs100-200mm
Note: After mass production, multiple wavelength lasers are generally used in combination, and not a single machine is used to complete all film layer production.